Analog Devices, Inc., a global leader in high-performance semiconductors for signal processing applications, introduced today the high-performance ADMP504 the industry's lowest-noise MEMS microphone. Delivering an SNR (signal-to-noise ratio) of 65-dBA, or 29-dBA EIN (equivalent input noise), the ADMP504 provides the same SNR performance as an array of two individual 62-dB SNR microphones. In addition, the ADMP504 provides an extended frequency response up to 20 kHz and a high PSR (power-supply-rejection) of 70 dBV. With this performance, the ADMP504 addresses the demanding requirements found in many industrial, professional audio and video conferencing applications. The new microphone leverages ADI's patented MEMS technology and audio signal processing expertise and is available in a thin 3.35 mm x 2.50 mm x 0.88 mm surface-mount package.
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Global shipments of MEMS microphones rose to 1.3 billion units in 2011, up 82 percent from 704 million in 2010 driven primarily by handsets, according to IHS.
"ADI's high-performance MEMS microphones have earned market acceptance since they entered the market in 2008, particularly in smartphones and media tablets," commented Jeremie Bouchaud, director and principal analyst, MEMS and sensors, IHS. "With further performance improvements, ADI is poised to enable many new and innovative applications in other markets such as industrial equipment monitoring and building security."
More About the ADMP504 MEMS Microphone
The ADMP504 is a surface mount MEMS microphone that is reflow solder compatible with no sensitivity degradation. The sensitivity specification of -38 dBV is well suited for many codecs and discrete signal chain components. The high SNR of 65 dBA, or 29 dBA EIN, enables far-field audio-capture applications, as well as those using multi-microphone "beam-forming" algorithms. Low current consumption of < 180 A (typ) with a power supply voltage of 1.6 V to 3.3 V extends battery life for portable applications.
ADMP504 MEMS Microphone Key Features and Benefits
- 65 dBA SNR, or 29 dBA EIN, enables excellent sound quality in high-definition applications.
- Extended frequency response out to 20 kHz produces a well-balanced and natural sound.
- High PSR of 70 dB V provides superior RF and electrical noise rejection allowing greater design flexibility for microphone placement and power trace routing.
- The sensitivity specification of -38 dBV makes this microphone an excellent choice for many codecs and discrete signal chain components.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, has expanded its motion-sensing portfolio with the addition of the market’s smallest three-axis digital-output gyroscope. ST’s L3G3200D enables advanced motion sensing in ever-shrinking form factors of next-generation mobile phones, tablets and other smart consumer devices, by reducing the package size by almost half over current-generation sensors.
Leveraging a well-consolidated single-sensing structure, the new 3 x 3.5 x 1 mm gyroscope exhibits excellent robustness and immunity to mechanical stress, along with outstanding temperature stability to deliver high-performance motion measurement along all three orthogonal axes.
Addressing power constraints in battery-operated portable devices, ST’s new gyroscope includes power-down and sleep modes, and an embedded FIFO (first-in first-out) memory block for smarter power management. It can operate with any supply voltage over the range of 2.4 to 3.6V with selectable full-scale ranges of ±250/500/2000 dps.
gyroscope provides a 16-bit data output on the interrupt and data-ready lines and it integrates low- and high-pass filters with user-selectable bandwidth. The device operates over an extended temperature range from -40°C to +85°C and includes a temperature sensor with an 8-bit data output.
, the leading provider of MotionProcessing™
Solutions for consumer electronics, today announced the introduction of a family of dual-axis gyroscopes, IDG-2020 and IXZ-2020, that address the market needs for optical image stabilization (OIS) in smartphones. Smartphones are rapidly replacing digital still cameras (DSC) as the devices of choice for capturing images; however, their image quality has generally been worse than DSCs due to blurry images, especially those taken in low-light conditions. By incorporating OIS technology, the same method adopted by many digital still camera manufacturers, smartphone image quality can be dramatically enhanced.
One of the major challenges of incorporating OIS technology into smartphones has been the availability of high performance, small size, and low cost MEMS gyroscopes. InvenSense is the first company to deliver both x-y (roll and pitch) and x-z (roll and yaw) dual-axis MEMS gyroscopes in a very small 3x3x0.75 mm form factor that meets the market demand. The new gyroscopes also incorporate a range of high performance features, including16-bit Analog to Digital Converters, less than 6mW of power consumption, and 27kHz drive frequency.
“Consumer demand for better image quality in smartphones has already resulted in the integration of 8+ megapixel image sensors, built-in auto-focus, and improved lens quality. The next obstacle to overcome is the elimination of blurred pictures due to hand jitter,” said Steve Nasiri, CEO and founder of InvenSense. “DSC manufacturers have successfully incorporated OIS technology to eliminate blurry pictures, and now with the availability of InvenSense’s new family of high performance gyroscopes, camera module makers for smartphones can provide the same capabilities in smartphones.”
IDG-2020 (x-y axis) and IXZ-2020 (x-z axis) leverages the company’s patented Nasiri-Fabrication process, the key technology which enables direct integration of MEMS mechanical structures with CMOS electronics at the wafer level, resulting in simple yet high performance solutions. The new gyroscopes offer features specifically tailored to meet OIS requirements, including the ability to have a factory full-scale output of ±32dps for highest sensitivity to detect slightest hand jitter, high-performance 32kHz ADC sampling, a nominal drive frequency of 27kHz, making the gyroscopes immune to interference from audible frequencies such as music or ambient noise, on-chip16-bit ADCs, low phase delay digital filters, and a high speed 20MHz SPI serial interface.
, an analog semiconductor company, today introduced the SiT530x family of Stratum 3
compliant silicon MEMS timing solutions that replace OCXOs and TCXOs. The SiT5301
are targeted at telecom and networking infrastructure such as SONET and Synchronous Ethernet based core and edge routers, wireless base stations, IP timing and smart grid applications. The SiT530x family uniquely combines Stratum 3 stability with small size, low voltage operation and programmable features that allows customers to quickly and easily customize and differentiate their products.
"SiTime's revolutionary technology integrates silicon MEMS and analog ICs to deliver innovative solutions. The quartz industry took decades to deliver this level of precision; SiTime, in 5 years, has broken through the same performance level. With our semiconductor expertise we have added unique features that offer additional value to the customer," said Rajesh Vashist, CEO of SiTime. "With game-changing products like the Stratum 3 clocks, and our recently announced differential-oscillators and vcxo, SiTime is accelerating the adoption of silicon MEMS timing products. SiTime is now addressing an oscillator market of $1 billion. Our remarkable combination of performance, lower cost and ease-of-use has successfully converted over 500 customers away from legacy quartz products."
"That a MEMS device can now replace OCXOs and TCXOs is a landmark that was considered unachievable for MEMS timing technology just a few years ago," said Jean-Christophe Eloy, CEO and founder of Yole Développement. "SiTime can now join a league of elite timing suppliers that service the highest performance applications. I think we can now safely say MEMS devices offer more features, higher performance and better value than quartz, which is driving the electronics industry's adoption of Silicon MEMS timing solutions."
"With the new SiT530x Stratum 3 products, SiTime continues to set new benchmarks in performance, features and reliability," said Jeff Eastman, SVP Global Marketing and Asset Management Arrow Electronics. "SiTime's programmable architecture ensures that Arrow always has SiTime products in stock. Many of our customers already enjoy the benefits of SiTime's silicon MEMS solutions today. With Arrow's large global footprint and SiTime's unique technology, we are well positioned to accelerate the proliferation of SiTime's innovative timing products into all segments of the electronics market."
The SiT530x family consists of two devices – the SiT5301, which operates from 1 to 60 MHz and the SiT5302, which operates from 60 to 220 MHz. Both devices offer the following features and benefits.
- Meets or exceeds Telcordia GR-1244 Stratum 3 frequency stability specifications for the most stringent timing applications
- ±0.1 PPM frequency stability over commercial temperature (0 to 70°C)
- <±0.37 PPM 24-hour holdover stability
- ±4.6 PPM frequency stability over 20 years
- Available in a 2520 compatible package, the industry's smallest ±100 PPB solution. This is a 60% reduction in size compared to any other Stratum 3 TCXO and 10 times smaller than an OCXO. The family is also available in 3225, 5032 and 7050 packages.
- Widest frequency range of 1 to 220 MHz with 6 digits of accuracy that allows designers to easily program custom frequencies and develop systems with better performance and reliability
- Unlike quartz, the SiT530x oscillators have no activity dips, which enable a more stable reference clock and superior system performance over temperature
- Operating voltage of 2.5V to 3.3V supports all telecom and networking SOCs, ASICs, and FPGAs and eliminates level translation
500 femtoseconds of typical integrated RMS phase jitter (12 kHz to 20 MHz) to meet the stringent requirements of telecom and networking applications
- SoftEdge™ configurable rise/fall time control improves trace impedance matching and reduces EMI
- Available voltage control with pull range of up to ±12.5 PPM for in-system calibration and fine-tuning over time
- Outstanding silicon reliability of 500 Million hours MTBF (10 times better than quartz)
- 50,000 g shock and 70 g vibration resistance (10 times better than quartz)
Samples will be available in December 2011 to qualified customers and production is planned for 1H2012. Pricing is available upon request.
Analog Devices, Inc. (ADI) released for general availability today the third generation iSensor® MEMS IMU (inertial measurement unit). The ADIS16488 is a tactical grade 10-degree-of-freedom (DoF) sensor and integrates a tri-axis gyroscope, tri-axis accelerometer, tri-axis magnetometer and a pressure sensor into a single package. This new MEMS IMU provides the most stable and complete integrated sensor suite available, supporting mission critical requirements in high-performance navigation and stabilization applications. Beyond the important tactical grade (below 10°/hr) bias stability, the ADIS16488 outperforms all other contemporary gyro/IMU offerings on the often more critical specifications of g-effect, temperature coefficient, and bandwidth by up to 100X.
Further, the new iSensor MEMS IMU even outperforms legacy military grade IMUs on vibration rectification and linearity. Every device undergoes unique and extensive factory calibration, resulting in unparalleled precision in the toughest environments and greatly reduces complexity, time, cost, and design risk relative to typical motion sensor development.
“For industrial, military, and medical equipment designers who require the most accurate detection and control of motion in order to stabilize or navigate their applications, the ADIS16488 tactical grade IMU offers performance levels previously only available to those with unlimited budgets,” said Bob Scannell, iSensor business development manager, MEMS/Sensors Technology Group, Analog Devices. “With equal or better performance to legacy high-end IMUs on key measures such as bias stability and angular random walk, the ADIS16488 provides better performance on the often more critical parameters of vibration-rectification, linearity, and bandwidth while consuming one-quarter the power, and at one-tenth the cost.”
More About the ADIS16488 iSensor 10-DoF MEMS IMU
The ADIS16488 iSensor 10-DoF MEMS IMU is a complete inertial measurement system that combines ADI’s high performance iMEMS® technology and sensor-signal processing expertise to optimize the IMU’s 10-DoF dynamic performance. Operation is fully autonomous, including all embedded compensations, with valid data available from the SPI interface 500 ms after applying power. With all calibration done at the factory, and with an ADI Blackfin® processor-powered configurable interface for tuning embedded filtering and other diagnostics, a major source of design integration time and risk is virtually eliminated.
ADIS16488 iSensor 10-DoF MEMS IMU Key Specifications
- Gyro bias in-run stability: 6°/hr
- Gyro dynamic range: 450°/s
- Gyro angular random walk: 0.3 °/rt-hr
- Gyro noise : 0.005 °/sec/√Hz rms
- Bias temperature coefficient: 0.0025°/s/°C
- Sensitivity temperature coefficient: 35 ppm/°C
- Accelerometer in-run stability:100 micro-g
- Accelerometer dynamic range: ±18g
- X/Y/Z alignment accuracy: 0.05°
- Magnetometer dynamic range +/- 3.5 gauss
- Barometer dynamic range 10 to 1200 mbar
, the leader in tunable radio frequency (RF) semiconductor products for the wireless industry, today introduced its WS2018 Antenna Tuner – the industry’s lowest current consumption antenna tuner. The single-chip design WS2018 sits in the RF signal chain between the antenna and the front-end module of a mobile phone and provides superior transmit and receive chain impedance optimization over the full 824 MHz – 2170 MHz Global mobile frequency range.
WiSpry’s innovative digitally tunable capacitor technology enables a completely new type of RF matching component that combines excellent RF performance with versatile digital control of the capacitance values. The WS2018 can be quickly re-programmed to compensate for antenna source impedance changes due to the need to operate over different frequency bands as well as to compensate for antenna load changes that are caused by hand, head and other body effects.
The digitally programmable capacitive elements implemented in WiSpry’s WS2018 are controlled by the modem via a MIPI Alliance RFFE or SPI serial interface, and make the WS2018 compatible with all popular Smartphone chipsets and modems.
“Our new WS2018 antenna tuner combines the industry’s best RF performance with the smallest form factor and the ability to tune any phase, any VSWR for 2G, 3G and LTE frequency bands,” said Victor Steel, VP of Products of WiSpry. “Our latest offering enables smaller antennas to deliver the high quality reception performance that today’s Smartphone users demand. We have also integrated the widely adopted MIPI RFFE interface, making this tuner plug-and-play compatible with all major Smartphone chipset vendors.”
The ultra low power WS2018 can be driven by an existing single supply rail such as an LDO regulator output or directly from the battery supply. The charge pump, serial bus and driver circuits are all fully integrated on the same CMOS die as the MEMS capacitor elements, making the WS2018 a true single chip solution for antenna impedance matching.
a leading provider of MEMS devices and sensor- based systems has announced the availability of its MXC6226XC MEMS two-axis digital accelerometer, the world's smallest, fully-integrated MEMS accelerometer. Based on MEMSIC's patented MEMS thermal technology, it is manufactured using a standard 0.18um CMOS process and advanced wafer- level packaging (WLP). The resulting device demonstrates MEMSIC's leadership in providing state-of-the-art motion sensing functions at a price- point never before available to designers of cost sensitive systems like cell phones, toys, games, cameras and appliances. The MXC6226XC accelerometer provides superior performance and functionality to designers who have previously not been able to consider motion sensing for their products. MEMSIC's MXC6226XC enables designers to significantly enhance the value of their product. It also serves as a high value-added replacement to designs employing mechanical switches, which are much less reliable and less capable.
The MEMSIC MXC6226XC digital accelerometer is the world's smallest production accelerometer measuring 1.2 mm. x 1.7mm. x 1.0 mm. and thus is approximately 50% smaller than competitive offerings. Its extremely small size and availability in a ball grid array (BGA) package provides designers enhanced flexibility for integration into space-constrained designs. The MXC6226XC integrates extensive signal conditioning circuitry, including a DSP, to enable superior motion sensing performance. Since it is based on MEMSIC's proven thermal accelerometer technology, which has no moving internal structures, the MXC6226XC exhibits extremely high shock survivability (up to 50,000g). This is five times greater than the shock survivability of capacitive accelerometers, and thus makes the MXC6226XC ideal for application in toys and cell phones, or other devices which are prone to being dropped onto hard surfaces. The MXC6226XC Digital Accelerometer can detect four orientation positions, offers shake detection and can measure acceleration over a +/- 2 g range with an absolute 0 g offset of less than +/- 50 mg. An I2C interface is used for communications and an interrupt pin (INT) is provided for shake and orientation detection. The device also has a power-down capability enabled through the I2C interface. Operating voltage is 2.5 v to 5.5 v. It operates over a -20 to +70 degree C. temperature range.
Dr. Yang Zhao, MEMSIC Chairman, President and CEO said, "Our wafer-level packaged digital accelerometer is truly a breakthrough design. We have listened to the voice of our customers who requested a small, low- priced, higher performance and function-rich solution to their existing and future motion sensing needs. Our engineers developed a design that perfectly matched their requirements by 'pulling out all the stops' when it comes to innovative design. Measuring only 2.0 mm. square in size, the MEMSIC digital accelerometer is the smallest full-function production accelerometer on the market today, the only one using wafer- level packaging (WLP) technology and the only single-chip MEMS accelerometer being built on a standard 0.18 um CMOS process. This is how we met their challenge." Dr. Zhao added, "Our solution leverages one of the inherent benefits of MEMSIC's approach - the elimination of moving parts. This makes our solution extremely robust and reliable in comparison to the mechanical approach used by other MEMS companies. The size reduction achievable with our high level of monolithic integration and WLP technology minimizes parts count and required board real estate. With our integrated DSP core, our digital accelerometer has the ability to add smart functionality and programmability. This simply is the best solution available today for consumer orientation sensing and control applications at this price. We expect to enable many new products through the adoption of the MXC6226XC."
SiTime Corporation, an analog semiconductor company, today introduced the timing industry’s highest performance differential oscillators with 10 PPM stability and only 500 femtoseconds of jitter, a unique combination that is only available from SiTime. The SiT9121 and SiT9122MEMS oscillators are targeted at high performance telecom, storage and networking applications such as core and edge routers, SATA / SAS / FibreChannel host bus adapters, cloud storage, servers, wireless base stations and 10G Ethernet switches. These devices can be configured exactly to the customer’s specification and shipped with the industry’s fastest lead times. In addition, each device has industry-standard footprints, enabling easy replacement of quartz differential oscillators without any design or layout changes.
“Traditional differential oscillators that are based on legacy quartz, SAW and overtone technology have inherent limitations in stability and reliability,” said Piyush Sevalia, vice president of marketing at SiTime. “The new SiT912x differential oscillators offer a unique combination of ultra performance and programmable features that were developed with SiTime’s analog CMOS and all-silicon MEMS technology. Our breakthrough products render traditional oscillators obsolete, and accelerate the electronics industry’s usage of MEMS oscillators.”
The SiT912x family consists of the following devices:
SiT9121: Ultra Performance Differential Oscillator (1-220 MHz)
SiT9122: Ultra Performance, High Frequency Differential Oscillator (220-650 MHz)
The SiT912x MEMS differential oscillators have the following features and benefits:
- 500 femtoseconds of integrated RMS phase jitter (12 kHz to 20 MHz) to meet the stringent requirements of applications such as SONET
- ±10, ±25, and ±50 PPM total frequency stability for better system timing margin
- Wide frequency range: 1 to 220 MHz for SiT9121 and 220 to 650 MHz for SiT9122
- Programmable frequency with 6 decimal places of accuracy, ensuring the highest system performance
- Configurable LVPECL and LVDS signaling levels
- 50,000 g shock and 70 g vibration resistance, along with 500 million hours MTBF for high reliability applications
- Operating voltage of 2.5V or 3.3V
- Industrial (-40 to +85°C) and extended commercial (-20 to +70°C)
- Industry standard footprints in 5.0x3.2mm and 7.0x5.0mm packages
- Sample shipments in 48 hours and production lead time of 3-5 weeks
The SiT9121 and SiT9122 differential oscillators will begin sampling in November 2011, while volume shipments are scheduled for February 2012. Pricing is available upon request.
SiTime Corporation, an analog semiconductor company, offers MEMS-based silicon timing solutions that replace legacy quartz products. With 85% market share and over 75 million devices shipped, SiTime is driving the $5 Billion timing market’s transition to 100% silicon-based timing.
SiTime’s configurable solutions enable customers to differentiate their products with higher performance, reduced size and better reliability. The rich feature set and flexibility of our solutions allows customers to consolidate their supply-chain, reducing cost of ownership and time to market. By using standard semiconductor processes and high volume plastic packaging, SiTime offers the best availability and shortest lead times in the industry.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications1, expanded its sensor portfolio with a new high-performance, low-power digital MEMS microphone. Housed inside an ultra-small 3x4x1 mm package, ST’s MP34DT01 top-port microphone delivers a best-in-class audio experience in mobile phones, tablets and other smart consumer devices.
A technology breakthrough, the MP34DT01 employs a patent-pending technology that allows designers to place the microphone membrane closer to the acoustic port hole on the top of the package with a substantial increase in performance and no penalty in size. It is the first MEMS microphone in the market that couples the advantage of a top-port sound-inlet position with unparalleled signal-to-noise ratio (SNR) of 63 dB and flat frequency response in the full audio band of 20–20,000 Hz.
ST’s MP34DT01 outclasses competing devices as the first top-port digital MEMS microphone with better acoustic parameters than existing bottom-port mics. This device perfectly matches the needs of clever speech-recognition systems for voice-controlled software and electronic-assistant applications being used in new consumer applications, where improving audio intelligibility without increasing the workload on the main processor, is a key factor. The device’s best-in-class SNR makes it also suitable for applications beyond typical consumer applications, such as phonometers – sound-level meters that require high dynamic range.ST’s MEMS microphones use best-in-class acoustic sensor technology jointly developed with OMRON that is inherently less susceptible to mechanical vibration, temperature variations and electromagnetic interference, while providing high-fidelity reproduction of audio signals at low power consumption.
In addition to the size, robustness and low-power advantages over traditional condenser microphones, MEMS microphones enable dramatic advancements in sound quality in multiple-microphone applications. Such microphone arrays, facilitated by the small form factor, superior sensitivity matching and frequency response of ST’s microphones, enable the implementation of active noise and echo cancelling, as well as beam-forming, a sound-processing technology that helps isolate a sound and its location. These features are invaluable with the increasing use of cell phones and other devices in noisy and uncontrollable environments.
ST’s MEMS microphones pair perfectly with the latest generation of the Company’s Sound Terminal® audio processing chips that feature a dedicated built-in interface for direct connection of a MEMS microphone, saving parts count and cost.
According to IHS iSuppli, the market for MEMS microphones for consumer electronics and mobile handsets is forecast to grow revenue at a CAGR of 23% between 2010 and 2014. The driving factors include the breakthrough in the use of noise suppression requiring multiple microphones, as well as adoption in new consumer applications beyond handsets and laptops, such as slate tablets and gaming.
The MP34DT01 is the second member in ST’s high-end MEMS microphone family and new devices with best-in-class SNR and trimmable sensitivity for matching within 1dB, coupled with further size reduction, are in the pipeline for 2012 and 2013.
, Inc. (ADI) is continuing to help industrial equipment designers improve system performance and reduce maintenance costs through more efficient vibration detection and isolation with the introduction today of the MEMS-based ADIS16228 iSensor vibration monitor
. The fully integrated vibration analysis system features an embedded programmable processor that provides directional sensing and spectral analysis to identify and classify individual sources of vibration. This enables the earliest possible detection, identification, and isolation of vibration sources from equipment and bearing wear that otherwise can lead to operating errors and costly equipment downtime. The noise performance of the ADIS16228 vibration monitor is specified at only 248 µg/ √Hz, across a dynamic range of ±18g, configurable to settings of 0 g to 1 g/5 g/10 g/20 g. By embedding these small vibration monitors, applications ranging from wind turbines to precision factory automation and assembly equipment will benefit from automatic vibration profiling.
- Download data sheet and see product page: ADIS16228
"MEMS accelerometers are well suited for vibration monitoring, but are typically at a low level of integration. With decades of integrated sensor processing experience, Analog Devices transformed a MEMS accelerometer into a 3-axis vibration analyzer with programmable embedded processing," said Bob Scannell, iSensor business development manager, MEMS/Sensors Group, Analog Devices. "For the first time, industrial equipment designers have a low noise, easy-to-use, affordable and complete vibration analyzer that is compact and directly embeddable."
The ADIS16228 iSensor vibration monitor eliminates the complexity and risk of developing a vibration solution from discrete components and enables a much wider application base, by integrating the intelligence and analysis only found in bulky handheld monitors which required trained vibration analysts. With the ADIS16228, developers have access to proven vibration sensing capability with frequency domain processing programmability and tuning that greatly improves the ability to isolate the vibration source quickly. The ADIS16228 is available in a 15 mm × 24 mm × 15 mm aluminum module with flanges, M2 machine screw holes, and a flexible connector that enables simple user interface and installation.
More About the ADIS16228 iSensor Digital Vibration Monitor
The ADIS16228 iSensor tri-axial, digital vibration monitor combines industry-leading iMEMS® sensor technology with ADI's data conversion and sensor signal processing technologies with convenient data capture and an SPI (serial peripheral interface). The SPI and data buffer structure provide easy access to sensor data. The ADIS16228 samples, processes and stores x, y and z acceleration data with FFT (fast Fourier transform) processing including time stamp. The programmable digital filter offers low-pass configuration options, and an internal clock drives the data sampling system during a data capture event, which eliminates the need for an external clock source. The data capture function has three different modes that will accommodate the needs of many different applications. The ADIS16228 also offers an integrated digital temperature sensor and digital power-supply measurements, as well as a digital self-test feature that enables reliable embedded operation within the targeted applications. The extended operating temperature range for the device is −40°C to +125°C. For more information, download the ADIS16228 data sheet.
ADIS16228 Key High-Performance Features and Benefits:
- Embedded frequency domain processing, 512-point, real-value FFT algorithms and on-board storage identify and classify individual sources of vibration, monitor changes over time and react to programmable threshold levels.
- Low-noise performance specified at 248 µg/ √Hz greatly improves the ability to discern unwanted vibration from normal operation.
- Programmable spectral alarm bands allow analysis of the full frequency spectrum with the configuration of 6 bands, Alarm1 (warning threshold) and Alarm2 (fault threshold) for earlier and more accurate fault detection.
- On-chip data capture function has three modes that offer several options to meet the needs of many different applications.
- User configurable multi-mode operation (including real-time-capture mode) allows more accurate assessment of even subtle vibration profile changes.