SEMulator3D 2008.100: New Selective Wet Etch and MEMS Lift-Off capabilities
Posted by coventor marketing on Mon, Feb 16, 2009 @ 08:08 AM
SEMulator3D 2008.100 enables more realistic wet etch emulation and MEMS lift-off.
Wet isotropic etch steps are commonly used in both Semiconductor and MEMS process flows. Wet etches are usually etch both laterally and vertically (ie, are isotropic) and etch different materials at different rates. The new "Selective Conformal Etch" capability realistically emulates wet etches by allowing the user to control both the vertical/lateral etch rates and individual material etch rates.
In MEMS technology, release etch steps commonly cause pieces of material to become detached from the wafer. These small pieces are usually flushed away by the etchant. A new "Lift-Off" function in SEMulator3D 2008.100 identifies separated pieces of material and removes them from the wafer.
Visit the SEMulator3D Download Center or contact your Coventor support representative for details about how to upgrade to SEMulator3D 2008.100.